[22a-A303-1~9] 13.5 Semiconductor devices/ Interconnect/ Integration technologies

9:45 AM - 10:00 AM JST(12:45 AM - 1:00 AM UTC)

[22a-A303-4] Analysis of vacancies in wafer bonding interface by positron annihilation lifetime spectroscopy

〇Sotetsu Saito¹, Nobutoshi Fujii¹, Shunsuke Furuse¹, Naoki Ogawa¹, Suguru Saito¹, Yoshiya Hagimoto¹, Hayato Iwamoto¹ (1.Sony Semiconductor Solutions Corp.)

Keywords:

bonding interface,positron annihilation lifetime spectroscopy