Presentation Information
[22a-A303-5]Cu wiring formed on polyimide film by selective neutral electroless copper plating
〇Yudai Hirano1, Sugiura Osamu1 (1.Chiba Inst of Tech.)
Keywords:
neutral copper plating,wiring,Integrated circuit
We are researching wiring formation by the neutral electroless copper plating method. The plating solution of the conventional electroless copper plating method using formaldehyde as a reducing agent has a pH of about 12, whereas the neutral electroless copper plating solution using a Co-ethylenediamine complex as a reducing agent removes copper at pH=7. Electroless plating is possible. This is advantageous for polyimide film applications that are damaged at high pH. In the previous report, tin chloride and copper chloride were used, but this time, we investigated a method for pretreatment using only a copper chloride aqueous solution to precipitate copper at the laser irradiation site.