Presentation Information
[22a-A303-6]Non-contact plating deposition of fine wiring by new electrolysis technology
〇Haruo Iwatsu1 (1.KMP Lavatory)
Keywords:
interconection,electrolytic,grain size
In the fine wiring process, films have conventionally been formed by electroplating through conductive films such as barrier and seed films in the damascene process. However, there are still problems in embedding in high-aspect vias and coarsening of wiring crystal grains for keeping wiring resistance low. This time, we report on bottom-up film formation from Via without barrier-seed film using new electrolytic technology.