Presentation Information
[22a-A303-8]Dependence of equilibrium electrode potential on magnetic field in cobalt ethylenediamine complex solution
〇Yuki Taguchi1, Sugiura Osamu1 (1.Chiba Inst of Tech)
Keywords:
Neutral electroless copper plating,Wiring Technology
Unlike conventional electroless copper plating methods, the neutral electroless copper plating method is suitable for integrated circuit manufacturing processes because (1) plating is possible at pH 7 and (2) there is no hydrogen gas emission. In addition, it has been experimentally shown that the plating rate increases by a factor of 2 to 3 when a magnetic field gradient is generated on the plated surface due to the magnetic properties of the cobalt ethylenediamine complex, which is the reducing agent. In this study, we investigated the possibility of capturing this plating acceleration effect by the change of electrode potential in the plating solution.