[22a-A602-1~9] 3.7 Optical measurement, instrumentation, and sensor (formerly 3.8)

11:15 AM - 11:30 AM JST(2:15 AM - 2:30 AM UTC)Presentation by Applicant for JSAP Young Scientists Presentation Award

[22a-A602-9] Development of a laser inspection scheme for semiconductor chips (Ⅱ)Development of a laser inspection scheme for semiconductor chips (Ⅱ)<o:p></o:p>

〇Reo Terauchi¹, Katsuhiro Mikami¹, Tetsuya Matsuyama¹, Kenichi Ikeda², Yusuke Nakaminami², Masanori Otake² (1.Kindai Univ., 2.Opto Systems Co., LTD)

Keywords:

semiconductor,principal component analysis,laser doppler vibrometer

In recent years, quality control of semiconductor chips used for LiDAR and other devices in automated driving systems has become a necessity. However, one of the current quality control methods, visual inspection, has a problem that defective products with cleavage cracks slip through the inspection. In our previous report, we reported a method that combines laser-induced vibrational wave inspection using a laser Doppler vibrometer and principal component analysis (PCA) as an automated fracture inspection method for small semiconductor chips[1]. This study aims to discriminate between normal and broken chips for different sizes and materials based on PCA results.