[17p-P06-1~3] 13.5 Semiconductor devices/ Interconnect/ Integration technologies | The 85th JSAP Autumn Meeting 2024

Session Details

Poster presentation13 Semiconductors : 13.5 Semiconductor devices/ Interconnect/ Integration technologies

[17p-P06-1~3]13.5 Semiconductor devices/ Interconnect/ Integration technologies

Tue. Sep 17, 2024 4:00 PM - 6:00 PM JST
Tue. Sep 17, 2024 7:00 AM - 9:00 AM UTC

P06 (Exhibition Hall A)

[17p-P06-1]Structural design of p-type HEMT using GeSiSn/GeSn heterostructure

〇(M1)Shota Torimoto¹, Mitsuo Sakashita¹, Masashi Kurosawa¹, Osamu Nakatsuka^1,2, Shigehisa Shibayama¹ (1.Grad. Sch. Eng., Nagoya Univ., 2.IMaSS)

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[17p-P06-2]Effect of Au particle diameter on the properties of Au particle sintered bumps for high-density semiconductor mounting

〇Noriaki Nakamura¹, Yuichi Makita¹, Akihito Fujino¹, Kohei Ogawa¹, Teruaki Koizumi¹, Hiroshi Murai¹, Kenichi Inoue¹, Yohei Okada², Haruki Shiratori², Hidehiro Kamiya² (1.TANAKA Kikinzoku Kogyo, 2.TUAT)

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[17p-P06-3]Temperature Dependence of I-V Characteristics Above Room Temperature of Needle Contact and Junction Contact Ge Schottky Barrier Diodes

〇Riku Ando¹, Yoriko Suda¹, Narihiko Maeda¹ (1.Tokyo Univ. of Technology)

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