[22p-61C-1~7] Progress in the semiconductor industry contributing to expanding IoT market and what are core technologies ?

1:40 PM - 2:10 PM JST(4:40 AM - 5:10 AM UTC)

[22p-61C-2] Development of 3D・chiplet integration technologies for the AI and IoT.

〇Yasuhiro Morikawa¹ (1.ULVAC ATI)

Keywords:

3D chiplet,Advanced packaging,Plasma dry etching

3D chiplet is indispensable for the realization of AI and IoT society, and the fusion of semiconductor front-end and back-end advanced packaging is essential to realize this technology. As part of this challenge, we used "modified polyphenylene ether (m-PPE)" as an interlayer dielectric material for back-end mounting, formed a mask pattern for fine Via etching by photolithography process, and attempted dry etching using inductively coupled plasma (ICP). As the results, the etching depth of 4.5 um and the aspect ratio of 2.25 is achieved. These results suggest that the introduction of semiconductor microfabrication technology in the field of back-end packaging can significantly improve not only performance but also production efficiency.