The 71st JSAP Spring Meeting 2024
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Session Details

Symposium (Oral)Symposium : Progress in the semiconductor industry contributing to expanding IoT market and what are core technologies ?

[22p-61C-1~7]Progress in the semiconductor industry contributing to expanding IoT market and what are core technologies ?

Fri. Mar 22, 2024 1:30 PM - 4:35 PM JST
Fri. Mar 22, 2024 4:30 AM - 7:35 AM UTC
61C (Building No. 6)
Masahide Goto(NHK), Toshishige Shimamura(NTT), Yuki Okamoto(AIST)
1:30 PM - 1:40 PM JST(4:30 AM - 4:40 AM UTC)

[22p-61C-1]Opening Remarks

〇Seiichi Hata1 (1.Nagoya Univ.)
1:40 PM - 2:10 PM JST(4:40 AM - 5:10 AM UTC)

[22p-61C-2]Development of 3D・chiplet integration technologies for the AI and IoT.

〇Yasuhiro Morikawa1 (1.ULVAC ATI)
2:10 PM - 2:40 PM JST(5:10 AM - 5:40 AM UTC)

[22p-61C-3]Bidirectional Remote Tactile Transmission AI System Using Ultrathin Piezoelectric MEMS Devices

〇Yusuke Takei1 (1.AIST)
2:40 PM - 3:10 PM JST(5:40 AM - 6:10 AM UTC)

[22p-61C-4]Silicon Migration Sean(SMS) wafer-level high vacuum packaging technologies

〇Yukio Suzuki1 (1.Tohoku Univ.)
3:30 PM - 4:00 PM JST(6:30 AM - 7:00 AM UTC)

[22p-61C-5]Virtualization of non-electric items using optically-powered miniaturized edge devices

〇Takashi Tokuda1, Yasufumi Yokoshiki1 (1.Tokyo Tech)
4:00 PM - 4:30 PM JST(7:00 AM - 7:30 AM UTC)

[22p-61C-6]Development of On-Device Learning AI Accelerator and CPU Core for Edge Devices

〇Takahiro Nishiyama1 (1.ROHM)
4:30 PM - 4:35 PM JST(7:30 AM - 7:35 AM UTC)

[22p-61C-7]Closing Remarks

〇Hidekuni Takao1 (1.Kagawa Univ.)
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