[22p-61C-1~7] Progress in the semiconductor industry contributing to expanding IoT market and what are core technologies ?

2:40 PM - 3:10 PM JST(5:40 AM - 6:10 AM UTC)

[22p-61C-4] Silicon Migration Sean(SMS) wafer-level high vacuum packaging technologies

〇Yukio Suzuki¹ (1.Tohoku Univ.)

Keywords:

Wafer-level packaging technologies,High vacuum encapsulation,Resonator MEMS

MEMS resonators were vacuum encapsulated at lower than 1 Pa by Silicon Migration Sealing (SMS) technology without getter. The tuning fork resonators were fabricated on a 6 inch SOI wafer and capped with a lid wafer with submicron release holes by direct bonding. After SMS, the encapsulated device was capacitively driven and sensed. The Q factor showed 56460 corresponds to about 1 Pa by suitable Hydrogen diffuse-out condition. Long term baking storage test at 150℃ showed 3.9 mTorr per year as leak rate.