[22p-71A-1~8] 【Open Symposium】A la carte Packaging Technologies: Challenges and Future Prospects of Advanced Semiconductor Packaging Technologies

2:15 PM - 2:45 PM JST(5:15 AM - 5:45 AM UTC)

[22p-71A-3] Packaging Technologies for Miniaturized Si Photonics Transceiver Chips

〇Koichi Takemura¹ (1.AIO Core)

Keywords:

silicon photonics,photonic integrated circuits,co-packaged optics

This presentation will cover packaging trends in photonics and electronics co-integration. The roles of packaging technologies in the performance of developed miniaturized Si photonics transceiver chips will be also explained.