[22p-71A-1~8] 【Open Symposium】A la carte Packaging Technologies: Challenges and Future Prospects of Advanced Semiconductor Packaging Technologies

4:45 PM - 5:15 PM JST(7:45 AM - 8:15 AM UTC)

[22p-71A-7] Present and future perspectives of 3D stacking technologies for CMOS image sensors

〇Hayato Iwamoto¹ (1.Sony Semiconductor Solutions Corporation)

Keywords:

CMOS image sensor,3D stacked,Cu-Cu connections