Presentation Information

[23p-12E-11]Fabrication of Multi-Finger Diamond Vertical MOSFETs with p+ substrate as source

〇(B)Yuki Takano1, Akira Takahashi1, Kosuke Ota1,2, Fuga Asai1, Yukihiro Chou1, Atsushi Hiraiwa3, Tatsuya Fujishima2, Hiroshi Kawarada1,2,3 (1.Waseda Univ., 2.Power Diamond Systems, Inc., 3.Kagami Memorial research Inst.)

Keywords:

diamond,vertical Multi-Finger MOSFET

In this study, we fabricated vertical multi-finger MOSFETs with P+ substrate as source. It achieved ID,max: 297.4 mA/mm at VGS: -30 V and VDS: -40 V. The current density increased by a factor of 1.5 when the trench width(WT) was increased by a factor of 2. This is thought to be due to the area where the gate contacts the p+ substrate is enlarged by enlarging the WT, facilitating the injection of holes from the p+ substrate. In addition, by doubling the number of fingers, the actual current increased approximately 2-fold while maintaining the current density even when (total gate width)WGT was enlarged by a factor of 2.