[23p-12J-1~10] 13.5 Semiconductor devices/ Interconnect/ Integration technologies

3:30 PM - 3:45 PM JST(6:30 AM - 6:45 AM UTC)

[23p-12J-6] Influence of Characteristics of Bonding Dielectric Film on CMP

〇Kenta Hayama¹, Kohei Nakayama¹, Fumihiro Inoue¹ (1.YOKOHAMA Nat. Univ.)

Keywords:

CMP