[23p-12J-1~10] 13.5 Semiconductor devices/ Interconnect/ Integration technologies

3:45 PM - 4:00 PM JST(6:45 AM - 7:00 AM UTC)

[23p-12J-7] Characterization of SiCN Interfaces for Low Temperature Hybrid Bonding

〇Ryosuke Sato¹, Sodai Ebiko¹, Koki Onishi¹, Fumihiro Inoue¹ (1.YOKOHAMA Nat. Univ.)

Keywords:

hybrid bonding