[24a-61B-1~8] 8.2 Plasma deposition of thin film, plasma etching and surface treatment

9:15 AM - 9:30 AM JST(12:15 AM - 12:30 AM UTC)

[24a-61B-2] Reduction Treatment on Gold Surface by Water Vapor Plasma at Low Pressure

〇Hirokazu Terai¹, Madoka Tsumaya¹, Osamu Tsuji¹ (1.Samco Inc.)

Keywords:

plasma cleaning,water vapor plasma: Aqua Plasma,semiconductor

In this study, plasma cleaning method for gold electrodes was investigated. Oxygen plasma cleaning has been widely used in semiconductor manufacturing processes, and the same applies to the gold electrodes. However, the gold surface is oxidized by oxygen plasma, and its adverse effects have been reported in recent years. The reduction effect of water vapor plasma was investigated in comparison with oxygen plasma. Au2O3 peaks were detected on the gold surface after oxygen plasma by XPS (X-ray Photoelectron Spectroscopy) analysis. In contrast, those were not detected after water vapor plasma.