[25a-61B-1~8] 8.2 Plasma deposition of thin film, plasma etching and surface treatment

10:00 AM - 10:15 AM JST(1:00 AM - 1:15 AM UTC)

[25a-61B-4] Influence of Duty Ratio on Charging Behavior at Capillary Plate Bottom in On-Off and High-Low modulated VHF Plasma

〇Yudai Akatsuka¹, Haruka Suzuki¹, Makoto Moriyama², Daiki Iino², Hiroyuki Fukumizu², Kazuaki Kurihara², Hirokata Toyoda¹ (1.Nagoya Univ., 2.KIOXIA Corp.)

Keywords:

Plasma,Reactive Ion Etching

In reactive ion etching using dual-frequency superposed capacitively coupled plasmas, the charging up of holes can cause shape anomalies. We have previously reported time-dependent charging behavior in VHF discharges with On-Off operation using a capillary plate (CP) as a model for etching holes. In this presentation, we report on the measurement of the charge density at the bottom of the CP during On-Off and High-Low modulation at different duty ratios.