Presentation Information

11:30 AM - 11:45 AM JST(2:30 AM - 2:45 AM UTC)

[10a-N301-10]Flip Transfer Process of Micro-LEDs with Sn/In Metal

〇Kazuto Matsui¹, Ryota Kanda¹, Atsushi Nishikawa², Alexander Loesing², Hiroto Sekiguchi^3,1 (1.Toyohashi Tech., 2.ALLOS, 3.Meijo Univ.)

Keywords:

Micro-LED,Transfer technology,Metal solder

In order to perform optical stimulation and potential measurement of brain neurons from the same direction, we developed a new transfer method in which micro-LEDs are inverted and directly bonded to metal wiring on a parylene film. A stepless structure was adopted for adjusting the height of the LED electrodes, and Sn/In metal solder was used to ensure bonding. We successfully bonded the inverted LEDs to the metal wiring and confirmed their emission.

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