Presentation Information

[10p-N301-7]Investigation of ScAlMgO4 substrate removal method for fabrication of thin-film LEDs

〇(M1)Minori Kinoshita1, Ryusei Sakamoto1, Ryoutarou Ito1, Ai Sakakibara1, Satoshi Kamiyama1, Tetuya Takeuchi1, Motoaki Iwaya1, Atushi Suzuki2, Seizi Ishimoto2 (1.Meijo Univ., 2.E&E Evolution Corp)

Keywords:

semiconductor

In nitride semiconductors, external quantum efficiency decreases with longer wavelengths due to lattice mismatch between GaN and GaInN. To address this, a ScAlMgO4 substrate was used to suppress strain. Cleaving enables thin-film structures and improves light extraction. Although manual cleaving has been reported, the method is unclear, and complete substrate removal is difficult. Therefore, a stepwise process was developed.