Presentation Information

4:45 PM - 5:00 PM JST(7:45 AM - 8:00 AM UTC)

[10p-N322-13]Defect characterization in SiC wafers by multimodal analysis using perspective transformation

〇Shunta Harada^1,2, Takahashi Kosei¹, Kota Tsujimori², Juheyong Sun¹, Michio Kawase¹, Yasutaka Matsubara¹, Keisuke Seo¹, Tatsuki Kodera¹, Kenta Shimamoto³, Seiya Mizutani⁴, Yuya MIzutani⁴, Seiji Mizutani⁴, Kenta Murayama⁴ (1.Nagoya Univ., 2.SSR, 3.Rigaku, 4.Mipox)

Keywords:

SiC,Mulyimodal Analysis,Perspective Transformation

We developed a multimodal defect characterization method for SiC wafers using perspective transformation-based image registration. By precisely aligning polarized-light microscopy (PLM) and X-ray topography (XRT) images, our approach enables comprehensive and non-destructive evaluation of threading dislocations. We also established an automated algorithm using template matching with simulated images, significantly improving objectivity and reproducibility of defect analysis. This method enhances efficiency in quality assessments, contributing to improved device reliability.

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