[8a-N324-1~11] 13.4 Si processing /Si based thin film / MEMS / Equipment technology

10:30 AM - 10:45 AM JST(1:30 AM - 1:45 AM UTC)

[8a-N324-6] Study of wafer thinning process using Minimal Fab

〇Hiroyuki Tanaka¹, Hiroshi Tokunaga², Yoshiyuki Nozawa³, Toshihiro Hayami³, Hiroshi Sugiyama⁴, Noriko Miura¹, Shinichi Ikeda¹, Shiro Hara^1,4 (1.AIST, 2.MTC, 3.SPPT, 4.HS)

Keywords:

Interposer,Packaging,Thinning

The packaging process is evolving into a semiconductor processing technology for the front-end process. We attempted to apply the technology cultivated in the front-end process of minimal equipment to the back-end process of semiconductor packaging. As one example, we focused on Si interposers. Manufacturing using by minimal fab is meaningful for low-volume, high-mix chiplet prototyping and also leads to improvements in packaging technology. First, we devised a Si interposer process specialized for thinning the Si substrate and investigated the Si bridge process technology. Then, we report on this.