Session Details

[8a-N324-1~11]13.4 Si processing /Si based thin film / MEMS / Equipment technology

Mon. Sep 8, 2025 9:00 AM - 12:00 PM JST
Mon. Sep 8, 2025 12:00 AM - 3:00 AM UTC
N324 (Lecture Hall North)

[8a-N324-1]Formation of TiO2 Films Using Minimal Fab Reactive Sputtering Tool

〇Shuichi Noda1, Yuuki Yabuta2, Naoko Yamamoto2, Kamei Ryuichiro2, Noriko Miura1, Shinichi Ikeda1, Shiro Hara1,3 (1.AIST, 2.Seinan-kogyo, 3.Hundred Semiconductors)

[8a-N324-2]Development and Contact Resistance Evaluation of Two-Layer Al Interconnection for AIHardware using Minimal Fab

〇Hirofumi Sumi1, Naonobu Shimamoto1, Yukinori Ochiai1, Tohru Mogami1, Yoshio Mita1, Makoto Ikeda1 (1.The Univ. of Tokyo, Systems design lab.)

[8a-N324-3]Development of Isolation Technology for SOI-CMOS Devices in Minimal-Fab Process

〇Hiroshige Kogayu1, Ryuhei Sekifuji1, Hiroyuki Tanaka2, Noriko Miura2, Shiro Hara1,2 (1.Hundred, 2.AIST)

[8a-N324-4]Analysis of wafer in-plane variation factors in Minimal Fab 2

〇Hiroyoshi Hongoh1, Shuichi Noda1, Noriko Miura1, Shinichi Ikeda1, Shiro Hara1,2 (1.AIST, 2.Hundred)

[8a-N324-5]Fabrication of TSVs using Minimal Fab system and evaluation of I/V

〇Takuro Kono1, Ryuhei Sekifuji2, Fumito Imura2, Hiroyuki Tanaka3, Noriko Miura3, Shiro Hara3, Toru Aonishi4, Ichiro Akai5, Yasuo Terasawa1, Takeshi Hashishin5 (1.NIDEK Co., LTD., 2.Hundred Semiconductors Inc., 3.AIST, 4.Tokyo Univ., 5.Kumamoto Univ.)

[8a-N324-6]Study of wafer thinning process using Minimal Fab

〇Hiroyuki Tanaka1, Hiroshi Tokunaga2, Yoshiyuki Nozawa3, Toshihiro Hayami3, Hiroshi Sugiyama4, Noriko Miura1, Shinichi Ikeda1, Shiro Hara1,4 (1.AIST, 2.MTC, 3.SPPT, 4.HS)

[8a-N324-7]Process development method for shrinking CMOS devices in Minimal Fab

〇Noriko Miura1, Hiroshige Kogayu2, Shinichi Ikeda1, Shiro Hara1,2 (1.AIST, 2.Hundred)

[8a-N324-8]Development strategy for new materials in Minimal Fab

〇Noriko Miura1, Kazumasa Nemoto1, Shuichi Noda1, Shinichi Ikeda1, Shiro Hara1,2 (1.AIST, 2.Hundred)

[8a-N324-9]Ultra Energy-saving for electronic chips by FusionCore technology

〇Shiro Hara1,2, Noriko Miura1, Shinichi Ikeda1, Fumito Imura2 (1.AIST, 2.Hundred)

[8a-N324-10]Applying Chiplet Technology to Low-Volume Wide-Variety Production: Development of the FusionCore Interconnect Technology

〇Fumito Imura1, Hiroshi Sugiyama1, Noriko Miura2, Shinichi Ikeda2, Shiro Hara1,2 (1.Hundred, 2.AIST)

[8a-N324-11]Controlling humidity and pressure in a process chamber in wafer droplet cleaning technology

〇Kazumasa Nemoto1, Noriko Miura1, Shinichi Ikeda1, Shiro Hara1,2 (1.AIST, 2.Hundred)