[8a-N324-1~11] 13.4 Si processing /Si based thin film / MEMS / Equipment technology

11:15 AM - 11:30 AM JST(2:15 AM - 2:30 AM UTC)

[8a-N324-9] Ultra Energy-saving for electronic chips by FusionCore technology

〇Shiro Hara^1,2, Noriko Miura¹, Shinichi Ikeda¹, Fumito Imura² (1.AIST, 2.Hundred)

Keywords:

Advanced Packaging Technology,Minimal Fab,Small-lot wide-variation

In order to apply chiplet technology to small-lot, wide-variation production, we have begun developing technology using a minimal fab that uses half-inch wafers and is suitable for small-lot, wide-variation production. We have named this technology FusionCore technology. FusionCore is an advanced packaging technology for the front-end, and is a new semiconductor technology that unifies the front-end and packaging processes for device manufacturing with half-inch wafers. In this presentation, we will discuss the energy-saving impact that FusionCore will have on the electronics industry.