Presentation Information

[8p-N324-6]Surface activated bonding of semiconductor wafers using ALD-Al2O3 thin film

〇Keigo Saito1, Ryuga Kikuchi1, Junichi Suzuki1, Reo Aoyama1, Rin Kawanabe1, Yoshiki Maruyama1, Shuto Fujiwara1, Taisei Kono1, Kouichi Akahane2, Yasushi Inoue1, Shiro Uchida1 (1.Chiba Tech., 2.NICT)

Keywords:

Surface activated bonding

In this study, we investigated the electrical characteristics when ALD-Al2O3 was introduced as an intermediate layer in p-Si/p-Si. We deposited Al2O3 on a p-Si substrate equipped with an ohmic electrode using ALD method and conducted a bonding experiment. The experimental results showed that the interface resistivity of p-Si/Al2O3//Al2O3/p-Si sample with annealed process decreased compared to the p-Si/p-Si sample.