Presentation Information
[8p-S202-3]Analysis of chemical mechanical polishing mechanism by molecular dynamics method using neural network potential
〇Yoshishige Okuno1 (1.Resonac Corp.)
Keywords:
chemical mechanical polishing,neural network potential,molecular dynamics method
Chemical mechanical polishing, an important front-end process in semiconductor manufacturing, in which silica substrates are polished with ceria abrasive grains in the presence of water, was analyzed at the molecular level by molecular dynamics calculations using neural network potential. The complex mechanism by which ceria and silica react in water was elucidated using virtual reality technology. The role of hydroxyl group concentration on the silica surface and the difference in polishing speed depending on the shape of the silica surface were also clarified. The results provide suggestions for improving slurries.