Presentation Information
[9a-N307-11]Sub-nanoscale structural analysis of corrosion protection film for copper fine wires on semiconducting devices by in-liquid AFM
〇Daiki Oka1, Hayashi Kaito1, Miyata Kazuki1, Uno Megumi2, Takatoh Chikako2, Fukuma Takeshi1 (1.Kanazawa Univ., 2.EBARA Corp.)
Keywords:
Semiconductor,CMP,3D-SFM