Presentation Information
[9p-N101-8]Advanced Thermal Management Devices and Charavterization Method s for 3D Semiconductor Chips
〇Hosei Nagano1 (1.Nagoya University)
Keywords:
Cooling,Loop heat pipe,3DIC
To advance the implementation of high-performance 3D integrated circuits (3DICs), it is essential to establish effective methods for dissipating internal heat generation while simultaneously enabling precise thermal property evaluation.
This talk introduces the development of a novel chip cooling technology based on a three-dimensional micro loop heat pipe (3D-μLHP). In addition, we present thermal property mapping techniques for visualizing internal thermal conductivity and interfacial thermal resistance within materials.
This talk introduces the development of a novel chip cooling technology based on a three-dimensional micro loop heat pipe (3D-μLHP). In addition, we present thermal property mapping techniques for visualizing internal thermal conductivity and interfacial thermal resistance within materials.