Session Details

[9p-N101-1~10][Open Symposium] Cutting-edge logic semiconductors and associated technologies

Tue. Sep 9, 2025 1:30 PM - 5:25 PM JST
Tue. Sep 9, 2025 4:30 AM - 8:25 AM UTC
N101 (Lecture Hall North)

[9p-N101-1]Opening

〇Osamu Nakatsuka1 (1.Nagoya University)

[9p-N101-2]The Latest activities on GAA-NS-FET and 3DSFET (CFET) technologies

〇Hitoshi Wakabayashi1 (1.Science Tokyo)

[9p-N101-3]Recent trends of gate stack technology

〇Shinji Migita1,2 (1.AIST, 2.LSTC)

[9p-N101-4]Emerging Trends in Post-Cu BEOL and Future Perspectives on Backside Interconnect

〇Fumihiro Inoue1 (1.Yokohama Nat. Univ.)

[9p-N101-5]Latest Trends in Epitaxial Growth and Silicon Substrates for Beyond 2nm Technology Node

〇Atsushi Ogura1,2, Koji Usuda2 (1.Sci.and Tech., Meiji Univ, 2.MREL, Meiji Univ.)

[9p-N101-6]AI technology to accelerate semiconductor manufacturing process development

〇Kentaro Kutsukake1, Toru Ujihara1, Shota Seki2, Masaki Takaishi2, Hiroki Nagakura3, Koichi Tanigawa3, Yuta Nagai4 (1.Nagoya Univ., 2.AIxtal, 3.Sony Semiconductor Manufacturing, 4.GlobalWafers Japan)

[9p-N101-7]HZO ferroelectric memory and its implications for novel computing technologies

〇Kasidit TOPRASERTPONG1, Zhenhong Liu1, Kosuke Ito1, Xuanhedong Gao1, Seong-Kun Cho1, Zuocheng Cai1, Eishin Nako1, Shin-Yi Min1, Rikuo Suzuki1, Ryosho Nakane1, Mitsuru Takenaka1, Shinichi Takagi1,2 (1.Univ. Tokyo, 2.Teikyo Univ.)

[9p-N101-8]Advanced Thermal Management Devices and Charavterization Method s for 3D Semiconductor Chips

〇Hosei Nagano1 (1.Nagoya University)

[9p-N101-9]Closing 1

〇Takaaki Tsunomura1 (1.Tokyo Electron Ltd.)

[9p-N101-10]Closing 2

〇Takeyasu Saito1 (1.Osaka Metropolitan Univ.)