[9p-N324-1~19] 8.2 Plasma deposition of thin film, plasma etching and surface treatment

2:15 PM - 2:30 PM JST(5:15 AM - 5:30 AM UTC)Presentation by Applicant for JSAP Young Scientists Presentation Award

[9p-N324-4] Pressure Change during Operation of High-Rate Filtered Arc Deposition System for TiN Film Preparation

〇Shogo Ochi¹, Mirano Oneda¹, Hirofumi Takikawa¹, Hiroaki Sugita², Takahiro Hattori², Hiroki Gima² (1.Toyohashi Univ. Technol., 2.OSG Corp.)

Keywords:

TiN,vacuum arc deposition

Vacuum arc deposition is one of the methods used for depositing TiN films. We are currently studying the industrial application of high-rate filtered arc deposition (HR-FAD) with a coiled anode, particularly focusing on understanding the pressure conditions that affect film quality. During this investigation, we found it necessary to examine the pressure changes occurring after arc ignition. In this study, we investigated the relationship between the pressure behavior and the flow rate of the introduced gas, as well as the conditions under which stable operation is possible. As a result, we confirmed that when the gas flow rate exceeds a certain threshold, the pressure temporarily drops during discharge but can be restored to the set value by adjusting the pumping speed. Conversely, when the flow rate is too low, the discharge becomes unstable, making film deposition difficult.