セッション詳細
[8a-P09-1~4]13.5 デバイス／配線／集積化技術
2025年9月8日(月) 9:30 〜 11:30
P09 (体育館)
[8a-P09-1]Nanotwinned Copper Formation Technology Using Inorganic Additive-Induced (111) Crystal Orientation
〇(DC)SooWoong Park1, Jaejeong Kim1 (1.Seoul National Univ.)
[8a-P09-2]Oxide-Based and Electroless Cu seeding on Glass Substrates Enabled by Liquid Phase Deposition
〇(D)Jiseok Lee1, Taeho Lim2, Jae Jeong Kim1 (1.Seoul National Univ., 2.Soongsil Univ.)
[8a-P09-3]Single accelerator systems for Cu microvia superfilling under pulse-reverse electrodeposition
〇(D)Huiju Seo1, Myung Jun Kim2, Jae Jeong Kim1 (1.Seoul National Univ., 2.Sungkyunkwan Univ.)
[8a-P09-4]Cu含有PVAフィルムを用いた抵抗変化素子の焼結時間依存性
〇岩澤 侑司1、牧島 唯斗1、中村 光我1、小林 亮太1、永井 裕己1、相川 慎也1 (1.工学院大工)