[14p-K101-1~7] Core technologies of the semiconductor industry supporting the progress in IoT society. -Fusion & Diversification-

1:40 PM - 2:10 PM JST(4:40 AM - 5:10 AM UTC)

[14p-K101-2] Application of direct wafer-bonding technology at room temperature to wireless, optical and sensing devices.

〇Yudai Uno¹, Ryosuke Hattori¹, Tai Tomoyoshi¹, Masahiko Namerikawa¹ (1.NGK Insulators, Ltd.)

Keywords:

direct bonding,MEMS,wafer

NGK Insulators, Ltd. has developed and mass-produced hybrid bonded wafers with excellent film thickness uniformity by directly bonding two types of different material wafers, such as functional layers and support layers, at room temperature, and then precisely machining the functional layer. Report on NGK Insulators' hybrid bonded wafer technology and its application examples in wireless and optical communications, and sensor devices.