Presentation Information

[14p-K401-4]Investigation of the Optical Active Layer Thickness in c-Plane InGaN/GaN pin-Type Light-Emitting ad Receiving Diodes

〇Yuuho Andou1, Shuhei Ichikawa1,2, Hiroshi Tabata1, Kazunobu Kojima1 (1.Osaka Univ., 2.R.S. for UHVEM)

Keywords:

semiconductor,nitride,optical device

In recent years, optical wireless systems have attracted significant attention. Additionally, there is a growing demand for device miniaturization, multifunctionality, and higher integration density. In response, we proposed a pin-type InGaN/GaN light-emitting and -receiving diode (LERD) that integrates currently separate light source and photodetector devices. Based on one-dimensional Schrödinger-Poisson equation simulations, we investigated the optimal structure. As a result, it was found that the optimal structure is achieved when the thickness of the optical active layer is 16 nm.These results provide important design guidelines for realizing the operation of LERD.

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