[15p-K201-1~8] Crossroads in Applied Physics: New trends in Glass and Laser Processing Technology

1:35 PM - 2:05 PM JST(4:35 AM - 5:05 AM UTC)

[15p-K201-2] High-speed glass drilling by ultrafast laser induced selective etching

〇Koji Sugioka¹ (1.RIKEN RAP)

Keywords:

ultrafast laser,Bessel beam,glass drilling

With Intel's declaration to adopt glass as an interposer material for chiplets, which are a next-generation semiconductor device manufacturing technology, the development of glass hole drilling technology has become an urgent issue. In response, ultrashort pulse laser-assisted selective etching (ULISE), in which the modified area is selectively removed using a solution such as hydrofluoric acid after internal modification of glass, is expected to be a promising glass hole drilling technology. This presentation will introduce a high-speed glass drilling technique using ULISE with a Bessel beam.