[15p-K305-1~14] 3.1 Basic optics and frontier of optics

5:00 PM - 5:15 PM JST(8:00 AM - 8:15 AM UTC)Presentation by Applicant for JSAP Young Scientists Presentation AwardEnglish Presentation

[15p-K305-14] Photonic wire bonding using high refractive index UV curable resin for dip-in 3D laser lithography

〇(M1)Lixin Xiang¹, Sho Okada², Katsunori Nishiura², Takuo Shikama³, Shu Nagamatsu¹, Towa Maekawa¹, Kensuke Otsuka³, Tomohir Amemiya¹ (1.Institute of Science Tokyo, 2.NICT, 3.Mitsui Chemicals, Inc)

Keywords:

high refractive index UV curable resin,dip-in 3D laser lithography,Photonic wire bonding