講演情報
[15p-K305-14]Photonic wire bonding using high refractive index UV curable resin for dip-in 3D laser lithography
〇(M1)Lixin Xiang1, Sho Okada2, Katsunori Nishiura2, Takuo Shikama3, Shu Nagamatsu1, Towa Maekawa1, Kensuke Otsuka3, Tomohir Amemiya1 (1.Institute of Science Tokyo, 2.NICT, 3.Mitsui Chemicals, Inc)
キーワード：
high refractive index UV curable resin、dip-in 3D laser lithography、Photonic wire bonding