[16a-K206-1~6] 11.3 Critical Current, Superconducting Power Applications

10:15 AM - 10:30 AM JST(1:15 AM - 1:30 AM UTC)Presentation by Applicant for JSAP Young Scientists Presentation Award

[16a-K206-5] Governing Factors and Effect of Bonding Materials in Sonic-Welding between Cu-Cu, Ag-Cu Stabilization Layers of REBCO Coated Conductors

〇Shinya Sera¹, Kenji Suzuki², Zeyu Wu¹, Kohei Higashikawa¹, Takanobu Kiss¹ (1.Kyushu Univ., 2.RTRI)

Keywords:

superconductivity,REBCO coated conductors,sonic-welding

The establishment of a reproducible low-resistance joining technique for Rare-Earth Barium Copper Oxide (REBCO) coated conductors (CCs) is essential as a fundamental technology for the practical application of CCs. In our previous study, we demonstrated that low-resistance joints between the metal stabilization layers of CCs can be achieved using a sonic-welding process. In this study, we investigated the effects of process parameters on the factors governing the joint resistivity of sonic-welding and proposed an analytical model to describe their behavior. The validity of the model was examined by comparing it with experimental results. Additionally, we experimentally demonstrated that the proposed technique can be applied not only to conventional Cu-stabilized layers but also to Ag layers, which are generally difficult to join using solder. The dependence of joint resistivity on process parameters exhibited similar behavior for Cu-Cu and Ag-Cu joints, and the proposed analytical model allowed for quantitative descriptions in both cases. However, the joint resistivity increased in the case of Ag-Cu joints. This phenomenon was analyzed based on the proposed model, considering the bonding energy of metallic atoms at the interface.