Presentation Information
[17a-K101-10]Component Prioritization Assessment in Gate-All-Around Nanosheet FETs using Design-Technology Co-Optimization (DTCO)
〇(D)Xiaoran Mei1, Yaoping Xiao1, Takuya Saraya1, Toshiro Hiramoto1, Masaharu Kobayashi1,2 (1.IIS, The Univ. of Tokyo, 2.d.lab, The Univ. of Tokyo)
Keywords:
Nanosheet,DTCO,ring oscillator
Advanced CMOS device, notably Gate-All-Around (GAA) Nanosheet and Complementary FET (CFET), are crucial in navigating post-Moore era's challenges, such as quantum confinement and lithography limitations. Leading entities such as IMEC[1][2], TSMC[3], and Samsung[4][5] are advancing innovations in device characteristics and parasitic capacitance optimization across Middle-End-Of-Line (MEOL) and Back-End-Of-Line (BEOL). This study enhances a 5-track 3nm Nanosheet-based inverter cell and ring oscillator (RO) using Design-Technology Co-Optimization (DTCO), achieving performance and power enhancements of 7.7% and 10.2%, respectively. A novel component analysis by Multiple Regression Analysis (MRA) further identifies CMEOL (MEOL capacitance) and device strategies as key factors for improving RO efficiency.
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