Presentation Information
[17a-K209-5]Development of thermal converters using a diamond heat spreader
〇Yasutaka Amagai1, Hiromitsu Kato1, Toshiharu Makino1, Junya Arakawa2, Kenjiro Okawa1, Hidekazu Muramatsu1, Norihiko Sakamoto1, Nobu-Hisa Kaneko1 (1.AIST, 2.Nikkohm)
Keywords:
Electrical standards,AC voltage/current standard,Diamond heat spreader
We have been developing a thermal converter using a diamond chip as a heat spreader to improve measurement sensitivity. The temperature distribution of a thermal converter using the diamond heat spreader was simulated using a finite element method. Owing to extremely high thermal conductivity of diamond material, the heat spreader effectively distributes the generated heat at the resistive heater toward the hot junction of the thermocouple. The simulation has shown that more uniform temperature distribution would be obtained compared with the previous heat spreader materials such as aluminum and aluminum nitride, expecting an improved measurement sensitivity.
Comment
To browse or post comments, you must log in.Log in