[17p-K305-1~12] 3.13 Silicon photonics, Photonics-electronics convergence, Optical control

3:30 PM - 3:45 PM JST(6:30 AM - 6:45 AM UTC)

[17p-K305-8] Investigation of Etching Process of Chip-on-wafer Heterogenious Material Bonding Process to SiO₂ Window Structure on Si Substrate

〇Masato Yoshii¹, Takehiko Kikuchi¹, Kenji Morita¹, Toshiaki Kitamura¹, Nobuhiko Nishiyama^1,2 (1.Science Tokyo Eng, 2.PETRA)

Keywords:

heterogeneous integration