[11a-PA2-1~4] 13.4 Si processing /Si based thin film / MEMS / Equipment technology | The 87th JSAP Autumn Meeting 2026

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Poster presentation13 Semiconductors : 13.4 Si processing /Si based thin film / MEMS / Equipment technology

[11a-PA2-1~4]13.4 Si processing /Si based thin film / MEMS / Equipment technology

Fri. Sep 11, 2026 9:00 AM - 10:30 AM JST
Fri. Sep 11, 2026 12:00 AM - 1:30 AM UTC

PA2 (1st Gymnasium)

[11a-PA2-1]Nano micro surface generation via Si epitaxial growth using helicon-sputtering

〇Akira Kakuta¹, Keisuke Watanabe¹ (1.NIT,Tokyo College)

[11a-PA2-2]Simple Air-Exposure-Free Direct Bonding of Fused Silica via Contacting in Ultrapure Water

〇Hidemasa Yamane¹ (1.ORIST)

[11a-PA2-3]Fabrication of a Si Slit for Space Ultraviolet Spectroscopy Using a Single-Sided Wet Etching Jig

〇(B)Itsuki Nagase¹, Yuki Ashikari¹, Tatsuya Sakamoto¹, Biao Zhao², Chiemi Oka¹, Ryoichi Koga³, Yasuhiro Hirahara², Seiichi Hata¹ (1.Nagoya Univ. School of Eng., 2.Nagoya Univ. School of Sci., 3.Nagoya City Univ. School of Data Sci.)

[11a-PA2-4]Molecular dynamics study of void formation process in the modified layer of laser-irradiated Si

〇(M2)Hiroki Okuzono¹, Manabu Ishimaru¹ (1.Kyushu inst.)

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