Presentation Information

[15a-PB1-2]Multiphysics Analysis for Evaluating Electromigration Reliability in Fine-Pitch Interconnects

〇Kaito Tabata1, Kensei Kugio1, Rozu Henmi1, Yusuke Mizobata1, Sho Hamano1, Munehiro Tada1 (1.Keio Univ.)

Keywords:

Electromigration