Presentation Information
[15a-PB1-3]Copper Strike Electroplating with Cellulose Nanofiber for Improved Throwing Power and Thick-Film Deposition while Maintaining Grain Refinement
〇Naoki Mizutani1, Ryuma Ishimine2, Hiroaki Koga3, Yujirou Takehara4, Masahiro Aoyagi4, Takeshi Hashishin3 (1.WDB Co., Ltd., 2.FE, Kumamoto Univ., 3.FAST, Kumamoto Univ., 4.SE, Kumamoto Univ.)
Keywords:
cellulose nanofiber,copper electroplating,semiconductor
In this study, cellulose nanofibers (CNFs) were applied to copper electroplating to investigate microstructure refinement and improved throwing power. By adding TEMPO-oxidized CNFs to a non-cyanide alkaline copper bath, a significant reduction in surface roughness was achieved while maintaining surface gloss, along with an increase in film thickness associated with an enhanced deposition rate. This presentation will also discuss the effects of CNFs on copper plating growth behavior and their potential applicability to thermal management and TSV-related electrode structures for semiconductor devices.