[15a-S4_203-1~11] 13.4 Si processing /Si based thin film / MEMS / Equipment technology

11:00 AM - 11:15 AM JST(2:00 AM - 2:15 AM UTC)

[15a-S4_203-8] Laser Microjet Cutting of 0.5-inch Wafers for Minimal Fab and ASIC Prototyping

〇Hirofumi Sumi¹, Naonobu Shimamoto¹, Yukinori Ochiai¹, Shinji Tsuboi¹, Tohru Mogami¹, Yoshio Mita¹, Hideharu Amano¹, Atsutake Kosuge¹, Makoto Ikeda¹ (1.The University of Tokyo)

Keywords:

Semiconductor LSI,ASIC,Minimal Fab

This study aims to establish a consistent process workflow that enables post-processing of ASICs fabricated on standard 200 mm wafers within the "Minimal Fab" environment. We employed Laser Microjet (LMJ) technology to excise 0.5-inch wafers from 200 mm substrates while suppressing thermal damage. Subsequently, a custom-developed automated beveling system was used to optimize wafer edge profiles, ensuring process compatibility for uniform resist coating. As a result, we successfully patterned the fifth metal layer using Minimal Fab equipment, including maskless lithography. This demonstrates a viable workflow for transferring devices from mass-production large-diameter wafers to the Minimal Fab line for subsequent wiring formation.