Presentation Information
[15p-SL_101-14]Thickness Scaling of Pt/(Al0.9Sc0.1)N/Pt Capacitors to 30 nm for Ferroelectric Memory Applications
〇(D)Soshun Doko1,2, Naoko Matsui1, Toshikazu Irisawa1, Koji Tsunekawa1, Nana Sun2, Yoshiko Nakamura2, Kazuki Okamoto2, Hiroshi Funakubo2 (1.Canon ANELVA, 2.Science Tokyo)
Keywords:
AlScN,logic-embedded memory,Ferroelectric memory
(Al,Sc)N films exhibit a large remanent polarization and excellent thermal stability, making them strong candidates for emerging non-volatile memory applications. We investigated the scaling of capacitor stacks and successfully achieved a total stack thickness of 30 nm, consisting of 5 nm Pt bottom electrode, 20 nm (Al0.9Sc0.1)N layer, and 5 nm Pt top electrode. In this study, we report the impact of thinning the Pt top electrode on the ferroelectricity.
