Presentation Information
[15p-WL2_401-5]Radiation hardness of H-diamond MOSFET using self-aligned CaF2/Cu-gate method
〇Hiroyuki Kawashima1, Yousuke Ito1,2, Kengo Oda2, Takahiro Yamaguchi1,2, Hitoshi Umezawa1, Junichi Kaneko1,2, Sadao Takeuchi3, Naohisa Hoshikawa1 (1.OOKUMA DIAMOND DEVICE Co., Ltd., 2.Hokkaido Univ., 3.NIT)
Keywords:
Diamond,MOSFET,Radiation hardness
Diamond devices are expected to be applied in harsh environments such as nuclear reactors. In this study, the X-ray radiation tolerance of diamond MOSFETs fabricated using a self-aligned gate process, which enables easy device miniaturization, was investigated. These diamond MOSFETs employed a CaF2/Cu gate insulator and electrode. X-ray irradiation up to a total dose of 10 MGy was performed, and the devices maintained electrical characteristics comparable to those before irradiation up to 3 MGy.
