[16a-S4_203-1~12] 7.2 Applications and technologies of electron beams

9:15 AM - 9:30 AM JST(12:15 AM - 12:30 AM UTC)

[16a-S4_203-2] Observation of TGV hole cracks using low-vacuum SEM

〇Yuanzhao Yao¹, Shuhei Shibuya¹, Minjae Kim¹, Wei Feng², Yusuke Takei², Takashi Sekiguchi¹ (1.Tsukuba Univ., 2.AIST)

Keywords:

Scanning Electron Microscope,low vacuum,Through Glass Via

TGV (Through Glass Via) structures are susceptible to crack formation during fabrication, and the observation of crack becomes increasingly difficult as miniaturization progresses. The mechanisms of crack initiation and propagation, as well as effective suppression methods, remain insufficiently understood. In this study, low vacuum SEM imaging combined with image analysis enabled high contrast observation of micro cracks without conductive coating and allowed automatic extraction of their geometric features. By analyzing the relationship between these extracted features and processing conditions, we identified key factors influencing crack initiation and propagation.