[16a-WL2_101-1~10] 6.4 Thin films and New materials

9:00 AM - 9:15 AM JST(12:00 AM - 12:15 AM UTC)

[16a-WL2_101-1] Adverse Effects of Ta Addition in Au Deposition and Their Solutions

〇Yudai Inagaki¹, Taichi Ito¹, Takanobu Yamazaki¹, Masatoshi Koyama², Koji Noguchi¹ (1.Matsuda Sangyo Co., Ltd., 2.Osaka Institute of Technology)

Keywords:

gold,tantalum,electron beam evaporation

Au thin films formed by electron beam (EB) evaporation are widely used as electrodes and interconnects in compound semiconductor devices. However, Au spitting attributed to carbon contamination in Au materials often occurs during EB evaporation, cause film defects, electrical short circuits, and yield reductions. Although adding Ta to the Au suppresses Au spitting, it induces the wick-out phenomenon of molten Au and can increase the film stress and resistivity. In this study, we investigated the effects of Ta addition and carbon content in Au on the film
properties.