[16p-M_178-1~8] New Developments in Microfabrication and MEMS Technologies Pioneering Next-Generation Sensing and Communications

1:40 PM - 2:10 PM JST(4:40 AM - 5:10 AM UTC)

[16p-M_178-2] 3D-IC Technology for Advanced Device Integration

〇Katsuya Kikuchi Kikuchi¹ (1.AIST)

Keywords:

3D-IC technology,bonding technology,TSV technology

In recent years, the rapid development of AI, IoT, and big data has led to a demand for even higher performance semiconductor devices. Until now, the improvement of semiconductor device performance has depended on the increase in integration density. However, as the limits of process miniaturization are being reached, the major trend is to increase integration density through vertical stacking (3D-IC). In this presentation, we will introduce R&D on fine bonding technology and TSV technology, which are the elemental technologies of latest 3D-IC technology.