Session Details
[16p-M_178-1~8]New Developments in Microfabrication and MEMS Technologies Pioneering Next-Generation Sensing and Communications
Mon. Mar 16, 2026 1:30 PM - 5:10 PM JST
Mon. Mar 16, 2026 4:30 AM - 8:10 AM UTC
Mon. Mar 16, 2026 4:30 AM - 8:10 AM UTC
M_178 (Main Bldg.)
[16p-M_178-1]Opening Remarks
〇Hidekuni Takao1 (1.Kagawa University)
[16p-M_178-2]3D-IC Technology for Advanced Device Integration
〇Katsuya Kikuchi Kikuchi1 (1.AIST)
[16p-M_178-3]Resin based Hybrid bondhing Technologies
〇Masao Tomikawa1 (1.Toray Industires)
[16p-M_178-4]A Novel Long-Wave IR Image Sensor Based on MEMS Technology
〇Shinji Hara1, Takahiro Nakagawa1, Maiko Shirokawa1, Kohki Kawamura1, Eiji Komura1, Susumu Aoki1, Masao Ichi1, Tadao Senriuchi1, Naoki Ohta1 (1.TDK Corp, Advanced Product Development Center, Tech & IP HQ)
[16p-M_178-5]Micro/nanofabrication techniques and metasurfaces for holographic imaging
〇Teruyoshi Nobukawa1, Tetsuhiko Muroi1, Kei Hagiwara1 (1.NHK)
[16p-M_178-6]Materials, devices, Systems for smart contact lens applications
〇Takeo Miyake1 (1.Waseda Univ)
[16p-M_178-7]Odor-tracking drones enabled by device integration of biological olfaction and their application prospects
〇Daigo Terutsuki1 (1.Shinshu Univ.)
[16p-M_178-8]Closing Talk
〇Masato Sone1 (1.Institute of Science Tokyo)
