[16p-M_178-1~8] New Developments in Microfabrication and MEMS Technologies Pioneering Next-Generation Sensing and Communications

2:10 PM - 2:40 PM JST(5:10 AM - 5:40 AM UTC)

[16p-M_178-3] Resin based Hybrid bondhing Technologies

〇Masao Tomikawa¹ (1.Toray Industires)

Keywords:

Polyimide,Adhesion,High Density Integration

Hybrid bonding is a technology for directly bonding insulator to each other and metal to metal, enabling high-density integration of electronic components such as MEMS and semiconductors. Until now, hybrid bonding has mainly been achieved by combining inorganic isulator such as silicon dioxide with copper, but this has posed challenges such as bonding failure by nano sized particles and warping due to high-temperature annealing. In response to these challenges, a low-elasticity polyimide has been developed, enabling a bonding yield of nearly 100% at temperatures below 200°C. This article reports on the current situation and exsiting challenges.