[17a-S2_201-1~13] 13.4 Si processing /Si based thin film / MEMS / Equipment technology

10:00 AM - 10:15 AM JST(1:00 AM - 1:15 AM UTC)Presentation by Applicant for JSAP Young Scientists Presentation Award

[17a-S2_201-5] Effect of Annealing on Mechanical Properties of Electroplated Gold Films on Ti Plate

〇Nobutaka Toake¹, Tomoyuki Kurioka¹, Shota Iima¹, Katsuyuki Machida¹, Chun-Yi Chen¹, Tso-Fu Mark Chang¹, Hiroyuki Ito¹, Yoshihiro Miyake¹, Masato Sone¹ (1.Science Tokyo)

Keywords:

gold electroplating,annealing,mechanical properties

We report the effect of annealing on the mechanical properties of electroplated gold films on titanium plates. Gold electroplating is performed at different current densities (4, 8, and 12 mA/cm²). The electroplated gold films are subjected to the annealing at 300 °C for 30 minutes in an argon atmosphere. Their mechanical properties are evaluated before and after the annealing by carrying out Vickers hardness tests. The Vickers hardness tests for the electroplated gold films show that Vickers hardness of the annealed samples is lower than those of the as-prepared samples, due to the increase in the grain size by annealing. This behavior follows the Hall-Petch relation.